Handbook of Silicon Based MEMS Materials and Technologies
Aus der Reihe
Micro & Nano Technologies
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- Hardcover
- Taschenbuch
- eBook ausgewählt
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Form:Einzelkauf Download
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Sprache:Englisch
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eBook Format:ePUB 3
- ePUB 3 200,00 € ausgewählt
- ePUB 215,00 €
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Auflage:2. Auflage
- 2. Auflage 200,00 € ausgewählt
- 3. Auflage 255,00 €
200,00 €
inkl. gesetzl. MwSt.Beschreibung
Produktdetails
Format
ePUB 3
Kopierschutz
Nein
Family Sharing
Nein
Text-to-Speech
Ja
Erscheinungsdatum
02.09.2015
Herausgeber
Markku Tilli + weitereVerlag
Elsevier Science & Techn.Seitenzahl
826 (Printausgabe)
Auflage
2. Auflage
Sprache
Englisch
EAN
9780323312233
The Handbook of Silicon Based MEMS Materials and Technologies, Second Edition, is a comprehensive guide to MEMS materials, technologies, and manufacturing that examines the state-of-the-art with a particular emphasis on silicon as the most important starting material used in MEMS.
The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals, and wafers, also covering micromachining technologies in MEMS and encapsulation of MEMS components.
Furthermore, it provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques, shows how to protect devices from the environment, and provides tactics to decrease package size for a dramatic reduction in costs.
- Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques
- Shows how to protect devices from the environment and decrease package size for a dramatic reduction in packaging costs
- Discusses properties, preparation, and growth of silicon crystals and wafers
- Explains the many properties (mechanical, electrostatic, optical, etc.), manufacturing, processing, measuring (including focused beam techniques), and multiscale modeling methods of MEMS structures
- Geared towards practical applications rather than theory
The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals, and wafers, also covering micromachining technologies in MEMS and encapsulation of MEMS components.
Furthermore, it provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques, shows how to protect devices from the environment, and provides tactics to decrease package size for a dramatic reduction in costs.
- Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques
- Shows how to protect devices from the environment and decrease package size for a dramatic reduction in packaging costs
- Discusses properties, preparation, and growth of silicon crystals and wafers
- Explains the many properties (mechanical, electrostatic, optical, etc.), manufacturing, processing, measuring (including focused beam techniques), and multiscale modeling methods of MEMS structures
- Geared towards practical applications rather than theory
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