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Moisture Sensitivity of Plastic Packages of IC Devices

Aus der Reihe Micro- and Opto-Electronic Materials, Structures, and Systems
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244,99 € UVP 274,99 €

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Beschreibung

Produktdetails

Einband

Gebundene Ausgabe

Erscheinungsdatum

19.07.2010

Abbildungen

XIV, 558 p.

Herausgeber

X.J. Fan + weitere

Verlag

Springer Us

Seitenzahl

558

Maße (L/B/H)

24,1/16/3,9 cm

Gewicht

1095 g

Auflage

2010

Sprache

Englisch

ISBN

978-1-4419-5718-4

Beschreibung

Portrait

Dr. Ephraim Suhir is Distinguished Member of Technical Staff (retired), Basic Research, Physical Sciences and Engineering Research Division, Bell Labs, Murray Hill, NJ. He is on the faculty of the Electrical Engineering Department, University of California, Santa Cruz, CA and the Department of Mechanical Engineering, University of Maryland, College Park, MD.

Produktdetails

Einband

Gebundene Ausgabe

Erscheinungsdatum

19.07.2010

Abbildungen

XIV, 558 p.

Herausgeber

Verlag

Springer Us

Seitenzahl

558

Maße (L/B/H)

24,1/16/3,9 cm

Gewicht

1095 g

Auflage

2010

Sprache

Englisch

ISBN

978-1-4419-5718-4

Herstelleradresse

Springer-Verlag GmbH
Europaplatz 3
69115 Heidelberg
DE

Email: ProductSafety@springernature.com

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  • Produktbild: Moisture Sensitivity of Plastic Packages of IC Devices
  • Produktbild: Moisture Sensitivity of Plastic Packages of IC Devices
  • Fundamental Characteristics of Moisture Transport, Diffusion, and the Moisture-Induced Damages in Polymeric Materials in Electronic Packaging.- Mechanism of Moisture Diffusion, Hygroscopic Swelling, and Adhesion Degradation in Epoxy Molding Compounds.- Real-Time Characterization of Moisture Absorption and Desorption.- Modeling of Moisture Diffusion and Whole-Field Vapor Pressure in Plastic Packages of IC Devices.- Characterization of Hygroscopic Deformations by Moiré Interferometry.- Characterization of Interfacial Hydrothermal Strength of Sandwiched Assembly Using Photomechanics Measurement Techniques.- Hygroscopic Swelling of Polymeric Materials in Electronic Packaging: Characterization and Analysis.- Modeling of Moisture Diffusion and Moisture-Induced Stresses in Semiconductor and MEMS Packages.- Methodology for Integrated Vapor Pressure, Hygroswelling, and Thermo-mechanical Stress Modeling of IC Packages.- Failure Criterion for Moisture-Sensitive Plastic Packages of Integrated Circuit (IC) Devices: Application and Extension of the Theory of Thin Plates of Large Deflections.- Continuum Theory in Moisture-Induced Failures of Encapsulated IC Devices.- Mechanism-Based Modeling of Thermal- and Moisture-Induced Failure of IC Devices.- New Method for Equivalent Acceleration of IPC/JEDEC Moisture Sensitivity Levels.- Moisture Sensitivity Level (MSL) Capability of Plastic-Encapsulated Packages.- Hygrothermal Delamination Analysis of Quad Flat No-Lead (QFN) Packages.- Industrial Applications of Moisture-Related Reliability Problems.- Underfill Selection Against Moisture in Flip Chip BGA Packages.- Moisture Sensitivity Investigations of 3D Stacked-Die Chip-Scale Packages (SCSPs).- Automated Simulation System of Moisture Diffusion and Hygrothermal Stress for MicroelectronicPackaging.- Moisture-Driven Electromigrative Degradation in Microelectronic Packages.- Interfacial Moisture Diffusion: Molecular Dynamics Simulation and Experimental Evaluation.