KI-Beratung Beta

Produktbild: Integrated System-Level Modeling of Network-on-Chip enabled Multi-Processor Platforms
- 13%

Integrated System-Level Modeling of Network-on-Chip enabled Multi-Processor Platforms

13% sparen

142,99 € UVP 164,99 €

inkl. gesetzl. MwSt., Versandkostenfrei


Beschreibung

We are presently observing a paradigm change in designing complex SoC as it occurs roughly every twelve years due to the exponentially increasing number of transistors on a chip. This design discontinuity, as all previous ones, is characterized by a move to a higher level of abstraction. This is required...

Beschreibung

We are presently observing a paradigm change in designing complex SoC as it occurs roughly every twelve years due to the exponentially increasing number of transistors on a chip. This design discontinuity, as all previous ones, is characterized by a move to a higher level of abstraction. This is required to cope with the rapidly increasing design costs. While the present paradigm change shares the move to a higher level of abstraction with all previous ones, there exists also a key difference. For the ?rst time shrinking geometries do not leadtoacorrespondingincreaseofperformance. InarecenttalkLisaSuofIBM pointed out that in 65nm technology only about 25% of performance increase can be attributed to scaling geometries while the lion share is due to innovative processor architecture [1]. We believe that this fact will revolutionize the entire semiconductor industry. What is the reason for the end of the traditional view of Moore’s law? It is instructive to look at the major drivers of the semiconductor industry: wireless communications and multimedia. Both areas are characterized by a rapidly increasingdemandofcomputationalpowerinordertoprocessthesophisticated algorithmsnecessarytooptimallyutilizethepreciousresourcebandwidth. The computational power cannot be provided by traditional processor architectures and shared bus type of interconnects. The simple reason for this fact is energy ef?ciency: there exist orders of magnitude between the energy ef?ciency of an algorithm implemented as a ?xed functionality computational element and of a software implementation on a processor.

Rezension

From the reviews:



"The book covers most of the major areas of system-level design and modeling, and much of the work described has been incorporated into a commercial ESL tool … . This book’s scope and range of pragmatic ideas make it valuable for a wide audience. … When combined with the extensive list of references (260!), this is a very valuable resource for anyone interested in the area … . It should resonate with students, researchers, and practical designers … ." (Grant Martin, IEEE Design and Test of Computers, May-June, 2007)

Produktdetails

Einband

Gebundene Ausgabe

Erscheinungsdatum

05.07.2006

Abbildungen

XIV, 186 p.

Verlag Springer Netherland

Produktdetails

Einband

Gebundene Ausgabe

Erscheinungsdatum

05.07.2006

Abbildungen

XIV, 186 p.

Verlag Springer Netherland
Seitenzahl

186

Maße (L/B/H)

24,8/16,5/1,4 cm

Gewicht

539 g

Auflage

2006 edition

Sprache

Englisch

ISBN

978-1-4020-4825-8

Herstelleradresse

Libri GmbH
Europaallee 1
36244 Bad Hersfeld
DE

Email: gpsr@libri.de

Noch keine Bewertungen vorhanden

Verfassen Sie die erste Bewertung zu diesem Artikel

Helfen Sie anderen Kundinnen und Kunden durch Ihre Meinung.

Kundinnen und Kunden meinen

Bewertungen (0)

  • Produktbild: Integrated System-Level Modeling of Network-on-Chip enabled Multi-Processor Platforms

  • Foreword. Preface.- 1. Introduction.- 2. Embedded SOC Applications.- 3. Classification of Platform Elements.- 4. System Level Design Principles.- 5. Related Work.- 6. Methodology Overview.- 7. Unified Timing Model.- 8. MP-SOC Simulation Framework.- 9. Case Study.- 10. Summary.- Appendices. A: The OSCI TLM Standard. B: The OCPIP TL3 Channel. C: The Architects View Framework.- List of Figures. List of Tables. References.- Index.