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Produktbild: Systems, Software and Services Process Improvement and Innovation
Band 3136 Neu

Systems, Software and Services Process Improvement and Innovation 33rd European Conference, EuroSPI 2026, Cairo, Egypt, September 8–10, 2026, Proceedings, Part I

Aus der Reihe Communications in Computer and Information Science

106,99 €

inkl. gesetzl. MwSt., Versandkostenfrei

Beschreibung

Produktdetails

Einband

Taschenbuch

Erscheinungsdatum

01.09.2026

Abbildungen

XXIII, 402 p. 146 illus., 120 illus. in color.

Herausgeber

Murat Yilmaz + weitere

Verlag

Springer

Seitenzahl

402

Maße (L/B/H)

23,5/15,5/2,4 cm

Gewicht

645 g

Sprache

Englisch

ISBN

978-3-032-36812-6

Beschreibung

Produktdetails

Einband

Taschenbuch

Erscheinungsdatum

01.09.2026

Abbildungen

XXIII, 402 p. 146 illus., 120 illus. in color.

Herausgeber

Verlag

Springer

Seitenzahl

402

Maße (L/B/H)

23,5/15,5/2,4 cm

Gewicht

645 g

Sprache

Englisch

ISBN

978-3-032-36812-6

Herstelleradresse

Springer Nature Customer Service Center GmbH
Europaplatz 3
69115 Heidelberg
DE
ProductSafety@springernature.com

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  • Produktbild: Systems, Software and Services Process Improvement and Innovation

  • .- Digitalisation of Industry, Infrastructure and E-Mobility .

    .- EU and China Quality Bridge: Integration of manufacturing, service management, and AI into the process landscape.

    .- AI-facilitated evaluation of test plan for software quality management automation.

    .- Anticipatory Mechanisms in Autonomous Vehicles: Architectural Integration from a Microethical Perspective .

    .- Ontology-based SBOM (Software Bill of Materials) Cross-Jurisdiction Compliance.

    .- Automotive Systems Layered AI Assurance.

    .- Evaluating DevOps, DevSecOps, MLOps and CloudOps – Results from an adapted MLR.

    .- A Data-Driven Engineering (DDE) Process for Verification and Validation of AI Systems.

    .- High Maturity Organisations .

    .- What are the Challenges in High Maturity Organizations.

    .- PIM.3: A Hidden Accelerator Behind ASPICE Level 3 Success.

    .- A KPI-Driven Framework for Monitoring Consistency and Process Friction in System Testing.

    .- Strategy to Foster High-Performance Characteristics in Newly Formed Teams.

    .- Innovation and Sustainability .

    .- Integrating Frugal Innovation into the Value Stream:  An Approach to Continuous Innovation Capability.

    .- Challenges in the Life Cycle Assessment (LCA) of Semiconductor Front-end Manufacturing: Insights from Field Experiences.

    .- The Innovation Management Capability Assessment Model - Automotive Skills Alliance  Innovation Agent Working Group.

    .- SmartSPI – Smart Data Analysis and Trusted GenAI Results  – Experiences of the Automotive Skills Alliance  innovation agent working group.

    .-  SPI and Functional Safety and Cybersecurity .

    .- Exploring the Integration of AI, Privacy, and Cybersecurity Risks into a Unified Risk Management Model.

    .- Human-variability-aware Safety Analysis Framework for Interactive Technologies of Critical Command and Control Systems.

    .- From Classical PKI to Hybrid PQC: A Crypto-Agile Migration Framework for Edge Systems.

    .- From Entropy to Decommissioning: Cryptographic Key Management Strategies Across the Automotive Supply Chain.

    .- ASIL Classified SW Apps on Vehicle Servers – A Safety Analysis Experience.

    .- Functional Safety for Sensor-Fusion-based  Automotive Perception Pipelines.

    .- The EuroSPI/ASA Certified Cybertester Job Role and Training Program.

    .- Two Regulatory Worlds, One Component: Bridging Automotive Cybersecurity Compliance and the Cyber Resilience Act.