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Produktbild: Integrated Wireless Power, Data Communication, and Thermal Sensing Systems for Autonomous Multisite Brain Implants

Integrated Wireless Power, Data Communication, and Thermal Sensing Systems for Autonomous Multisite Brain Implants

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Beschreibung

This book provides professionals in microelectronic implantable bio-medical systems an overview of recent techniques in wireless power and data telemetry. State-of-the-art techniques are overviewed and original methods presented. The book features an up-to-date overview of CMOS wireless telemetry microelectronics...

Beschreibung

This book provides professionals in microelectronic implantable bio-medical systems an overview of recent techniques in wireless power and data telemetry. State-of-the-art techniques are overviewed and original methods presented. The book features an up-to-date overview of CMOS wireless telemetry microelectronics for cortical implants. The book gathers all layers of microelectronics wireless power and data transmission for cortical implants, discusses them in a critical manner and proposes solutions, i.e., at circuit and systems and system levels. This book compiles relevant information into a coherent presentation of the technical issues, proposed solutions and their compared efficiency, and details the authors’ original approaches. Professionals of microelectronics will find useful and accessible descriptions of the major issues and solutions to wireless telemetry. Researchers and professionals in bio-medical implantable systems will find fully justified novel methods in power and data telemetry and implantable systems telemetry architectures. 

Produktdetails

Einband

Gebundene Ausgabe

Erscheinungsdatum

22.07.2025

Abbildungen

XVI, 156 p. 121 illus., 70 illus. in color.

Verlag Springer

Produktdetails

Einband

Gebundene Ausgabe

Erscheinungsdatum

22.07.2025

Abbildungen

XVI, 156 p. 121 illus., 70 illus. in color.

Verlag Springer
Seitenzahl

156

Maße (L/B/H)

24,6/17,3/1,5 cm

Gewicht

453 g

Sprache

Englisch

ISBN

978-3-031-90838-5

Herstelleradresse

Springer-Verlag GmbH
Europaplatz 3
69115 Heidelberg
DE

Email: ProductSafety@springernature.com

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  • Produktbild: Integrated Wireless Power, Data Communication, and Thermal Sensing Systems for Autonomous Multisite Brain Implants

  • Introduction.- Wirelessly Powered Biomedical Implants.- System-Level Modeling.- Implantable Dual-Band Inductive Link.- Wireless Power Conversion Chain and Control Methods.- Wireless Data Communication.- On-chip CMOS Temperature Sensing.- System-on-Chip Integration.- Conclusion.