Produktbild: Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Volume 6

Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Volume 6 Proceedings of the 2019 Annual Conference on Experimental and Applied Mechanics

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Beschreibung

Produktdetails

Einband

Gebundene Ausgabe

Erscheinungsdatum

23.01.2020

Herausgeber

Antonio Baldi + weitere

Verlag

Springer

Seitenzahl

169

Maße (L/B/H)

28,5/21,5/1,6 cm

Gewicht

614 g

Auflage

1st ed. 2020

Sprache

Englisch

ISBN

978-3-030-30097-5

Beschreibung

Portrait

Antonio Baldi – University of Cagliari, Sardinia, Italy; Xavier Balandraud – Sigma Clermont Engineering School, France; Sharlotte L.B. Kramer – Sandia National Laboratories, Albuquerque, NM, USA; Fabrice Pierron – University of Southampton, Southampton, UK; John Considine - United States Forrest Service, Madison, WI, USA; Sven Bossuyt – Aalto University, Aalto, Finland; Johan Hoefnagels – Eindhoven University of Technology, Eindhoven, Netherlands.

Produktdetails

Einband

Gebundene Ausgabe

Erscheinungsdatum

23.01.2020

Herausgeber

Verlag

Springer

Seitenzahl

169

Maße (L/B/H)

28,5/21,5/1,6 cm

Gewicht

614 g

Auflage

1st ed. 2020

Sprache

Englisch

ISBN

978-3-030-30097-5

Herstelleradresse

Springer-Verlag KG
Sachsenplatz 4-6
1201 Wien
AT

Email: GPSR Kontakt

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  • Produktbild: Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Volume 6
  • 1. Regularization Uncertainty in Slitting Residual Stress Measurement.- 2. Walkthrough and History of the Virtual Fields Method.- 3. Low-Cost Thermoelastic Stress Analysis.- 4. Keynote: Residual Stresses in Biological Materials.- 5. The Effect of Residual Stress on Aluminum Strength using Thermoelatic Stress Analysis.- 6. Calibration of Anisotropic Plasticity Models with an Optimized Heterogeneous Test and the Virtual Fields Method.- 7. One-Dimensional Heat Source Reconstruction Applied to Phase Transforming Superelastic Ni-Ti Wire.- 8. Coupled NIRT/3D-DIC for a FEMU Identification of the Thermo-mechanical Behavior of Zr-4 Claddings under Simulated Reactivity Initiated Accident.- 9. Quench-induced Residual Stress in Complex Geometry: Measurement and Modeling by Eigenstrain.- 10. Residual Stresses at Critical Locations in Additively-Manufactured Components.- 11. Identification of Constitutive Parameters Governing the Hyperelastic Response of Rubber by Using Full-field Measurement and the Virtual Fields Method.- 12. Intermethod Comparison and Evaluation of Near Surface Residual Stress in Aluminum Parts Subject to Various Milling Parameters.- 13. Inversion of Residual Stresses in Silicon Wafer from Surface Deflection Measurements.- 14. Evaluating the Coefficient of Thermal Expansion of Electronic Board Using the Virtual Fields Method.- 15. Identification of Constitutive Parameters from Full Thermal and Kinematic Fields: Application to Hyperelasticity.- 16. Calorific Analysis of a Granular System made in Shape Memory Alloy.- 17. Dynamic VFM to Identify Viscoplastic Parameters. Analysis of Impact Tests on Titanium Alloy.- 18. Keynote: Test Design for Identification from Full-field Measurements: A Concise Review.- 19. Stress Determination for Granular Materials Using TSA: An Inverse Approach.- 20. Evaluation of Fatigue Crack Growth Behavior and Effect of Repair Work Based on Thermoelastic Stress Analysis for Steel Bridge Members.- 21. Analysis of Deformations in Crush Tests of Lithium Ion Battery Cells.- 22. In-situ thermal monitoring of printed components during rapid prototyping by Fused Deposition Modeling.- 23. Development of an Inverse Identification Method for Identifying Hyperelastic Constitutive Parameters by Metaheuristic Optimization Algorithm.- 24. MIMO Input Derivations, Optimizing Input Force Against Output Accuracy.- 25. Evaluation of Sensitivity-Based Virtual Fields for Non-Linear Parameter Identification Including DIC Filtering Effects.- 26. Identification of Inhomogeneous Plastic Constitutive Models of Friction Stir Welded Aluminum Alloy Sheets Using Virtual Fields Method.- 27. Accuracy Improvement of Thermoelastic Stress and Dissipation Energy Measurement by Motion Compensation with Optical-Infraredynchronous Measurement.