Vor Ort
Merkzettel Warenkorb
Produktbild: RF and Microwave Microelectronics Packaging II

RF and Microwave Microelectronics Packaging II

131,99 €

inkl. gesetzl. MwSt., Versandkostenfrei

Beschreibung

Produktdetails

Einband

Taschenbuch

Erscheinungsdatum

09.06.2018

Abbildungen

XII, 172 p. 127 illus., 77 illus. in color.

Herausgeber

Ken Kuang + weitere

Verlag

Springer

Seitenzahl

172

Maße (L/B/H)

23,5/15,5/1,1 cm

Gewicht

295 g

Auflage

Softcover reprint of the original 1st ed. 2017

Sprache

Englisch

ISBN

978-3-319-84719-1

Beschreibung

Portrait


Ken Kuang is President of Torrey Hills Technologies, LLC, a leader in the supply of quality microelectronics packaging components. From 2004-2013, Kuang led Torrey Hills to rank #188 in INC500 Fast Growing Private Companies in America and rank #2 in San Diego Business Journal 100 Fastest Growing Private Companies in San Diego. Kuang was three times the finalist for the Most Admired CEO in San Diego. 



Rick Sturdivant has been President of Microwave Packaging Technology, Inc. (MPT) since 2003. He regularly presents at conference workshops and other venues, and has been a guest lecturer at Georgia Tech Research Institute. He is a recognized expert in the field of Transmit/Receive (T/R) modules for phased array radar and communication systems.

Produktdetails

Einband

Taschenbuch

Erscheinungsdatum

09.06.2018

Abbildungen

XII, 172 p. 127 illus., 77 illus. in color.

Herausgeber

Verlag

Springer

Seitenzahl

172

Maße (L/B/H)

23,5/15,5/1,1 cm

Gewicht

295 g

Auflage

Softcover reprint of the original 1st ed. 2017

Sprache

Englisch

ISBN

978-3-319-84719-1

Herstelleradresse

Springer-Verlag GmbH
Tiergartenstr. 17
69121 Heidelberg
DE

Email: ProductSafety@springernature.com

Noch keine Bewertungen vorhanden

Verfassen Sie die erste Bewertung zu diesem Artikel

Helfen Sie anderen Kundinnen und Kunden durch Ihre Meinung.

Kundinnen und Kunden meinen

Bewertungen (0)
  • Produktbild: RF and Microwave Microelectronics Packaging II

  • Chapter1. Introduction to RF and Microwave Microelectronic Packaging.- Chapter2. Packaging of Transmit/Receive Modules.- Chapter3. 3D Transitions and Connections.- Chapter4. Electromagnetic Shielding for RF & Microwave Packages.- Chapter5. Design of C-Band Interdigital Filter and Compact C-band Hairpin Bandpass Film Filter on Thin Film Substrate.- Chapter6. Research on High-reliable Low-loss HTCC Technology Applied in Millimeter Wave SMT Package.- Chapter7. Chip Size Packaging (CSP) for RF MEMS Devices.- Chapter8. The challenge in packaging and assembly the advanced power amplifiers.- Chapter9. High Thermal Conductivity Materials – Aluminum Diamond, Aluminum Silicon Carbide, and Copper Diamond.- Chapter10. Advancement in High Thermal Conductive Graphite for Microelectronic Packaging.- Chapter11. Carbon nanotubes and graphene for microwave/RF electronics packaging.