Handbook of Materials Failure Analysis With Case Studies from the Electronic and Textile Industries

Part 1: Electronics Industries
1. Failures of Electronic Devices: Solder Joints Failure Modes, Causes and Detection Method
2. Electron-beam Radiation Damage and the Technical Solutions for Materials Failure Analysis of Electron-beam Sensitive Materials in Modern Semiconductor Industry
3. Failure of intermetallic solder ball due to stress shielding and amplification effects
4. Assessment of the indoor corrosion in consumer electronics in subtropical climates.
5. Pb-free Solder - Microstructural, Material Reliability and Failure Relationships
6. The Role of Contamination in Failures of Electronics - Case Studies
7. Reliability analysis of vibrating electronic assemblies using analytical solutions and response surface methodology
8. Stress Analysis of Stretchable Conductive Polymer for Electronics Circuit Application
9. New methodology for qualification and lifetime assessment of electronic systems

Part 2: Textiles Industries
10. Textile Failure Analysis and Mechanical Behavior Characterization by using Acoustic Emission Technique
11. Failure of yarns in different textile applications
12. Treatment effect on failure mode of industrial carbon textile at elevated temperature