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Produktbild: The Mechanics of Solder Alloy Wetting and Spreading
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The Mechanics of Solder Alloy Wetting and Spreading

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Beschreibung

Produktdetails

Einband

Taschenbuch

Erscheinungsdatum

08.03.2012

Verlag

Springer Us

Seitenzahl

250

Maße (L/B/H)

22,9/15,2/2,1 cm

Gewicht

550 g

Auflage

1993

Sprache

Englisch

ISBN

978-1-4684-1442-4

Beschreibung

Produktdetails

Einband

Taschenbuch

Erscheinungsdatum

08.03.2012

Verlag

Springer Us

Seitenzahl

250

Maße (L/B/H)

22,9/15,2/2,1 cm

Gewicht

550 g

Auflage

1993

Sprache

Englisch

ISBN

978-1-4684-1442-4

Herstelleradresse

Springer-Verlag GmbH
Tiergartenstr. 17
69121 Heidelberg
DE

Email: GPSR Kontakt

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  • Produktbild: The Mechanics of Solder Alloy Wetting and Spreading
  • 1. Introduction: The Mechanics of Solder Alloy Wetting and Spreading.- 1.1 Soldering in Electronics.- 1.2 The Wetting Problem.- References.- 2. Solderability Testing.- 2.1 Introduction.- 2.1.1 Definition of Solderability.- 2.1.2 Why Test for Solderability.- 2.1.3 The Obstacles to Progress in Testing.- 2.2 The “Numbers” Problem.- 2.2.1 Dip Tests.- 2.2.2 Dip Tests Versus Six Sigma Quality.- 2.2.3 Wetting Balance (Surface Tension Balance).- 2.2.4 Microwetting Balance.- 2.2.5 Configured Capillary.- 2.3 The Consistency Problem.- 2.3.1 Sample-to-Sample.- 2.3.2 Operator-to-Operator and Location-to-Location.- 2.4 The Requirements Problem.- 2.5 The Aging Problem.- 2.6 Conclusions.- 2.7 Appendix.- 2.7.1 A Descriptive and Practical Definition of Wettability and Solderability.- 2.7.2 Wettability.- 2.7.3 Solderability.- 2.7.4 Solder Process Yield.- References.- 3. Fluxes and Flux Action.- 3.1 Introduction.- 3.2 Flux History.- 3.3 Flux Requirements.- 3.4 Rosin-Based Fluxes.- 3.4.1 Rosin Flux Formulations.- 3.4.2 Flux Contents.- 3.4.3 Chemistry of Rosin.- 3.4.4 Synthetic Resin/Rosins.- 3.4.5 Mechanistic Inference.- 3.4.6 Wetting Balance Performance of Rosin Fluxes.- 3.4.7 An Active-Constituent, Concentration-Dependent Mechanism.- 3.4.8 Autocatalysis and Chain Reaction Equations.- 3.4.9 Implications of Alternative Mechanisms.- 3.4.10 Effect of Impurities in Solder with Rosin Flux.- 3.4.11 Effects of Fluxes on Surface Tension.- 3.4.12 Flux/Oxide Reactions for CuO.- 3.4.13 Effect of Atmosphere.- 3.4.14 Reaction Temperature Effects.- 3.4.15 Use of Other Oxides.- 3.4.16 A Flux Activity Number.- 3.4.17 Thermodynamics of Flux Action.- 3.4.18 Abietic Acid, Decomposition, and Interactions.- 3.4.19 Triethanolamine-Hydrochloride (TEA-HCI) and Decomposition.- 3.4.20 Materials Combinations: Building a Solder Cream.- 3.4.21 Fourier Transform Infrared Analysis.- 3.4.22 Flux Residues.- 3.4.23 Rosin Flux Formulations.- 3.4.24 Low Solids Fluxes.- 3.5 Gaseous Fluxes.- 3.5.1 Nitrogen Atmospheres.- 3.5.2 N2/H2 Atmospheres (including Ar(H2)).- 3.5.3 N2 Reactive Mixtures.- 3.5.4 Analysis of Residues.- 3.6 Inorganic Fluxes.- 3.6.1 Mechanistic Studies.- 3.7 Effect of Solder Impurities on Solderability.- 3.7.1 An Electrochemical Mechanism.- 3.8 Solderability Tests.- 3.8.1 Visual Assessment.- 3.8.2 Area-of-Spread Test.- 3.8.3 Edge Dip and Capillary Rise Tests.- 3.8.4 Globule Test.- 3.8.5 Rotary Dip Test.- 3.8.6 Surface Tension Balance Test.- 3.8.7 Flux Action from Solderability Measurements.- 3.8.8 Status of Flux Development and Flux Action Studies.- References.- 4. Reactive Wetting and Intermetallic Formation.- 4.1 Introduction.- 4.2 Analysis of Solder Spreading Kinetics.- 4.2.1 Heat Flow.- 4.2.2 Fluid Flow.- 4.2.3 Spreading of Spherical Droplets.- 4.3 Contact Line Motion Over Obstacles.- 4.3.1 Static Contact Angles.- 4.3.2 Effective Contact Angle.- 4.4 Metallurgy of the Moving Contact Line.- 4.5 Thermodynamic Calculation of the Ternary Pb-Sn-Cu System.- 4.5.1 General Thermodynamic Description.- 4.5.2 Binary Pb-Sn.- 4.5.3 Binary Cu-Pb.- 4.5.4 Binary Cu-Sn.- 4.5.5 Ternary System Cu-Pb-Sn.- 4.6 Wetting Balance Studies on Cu6sn5 and Cu3Sn.- 4.7 Conclusion.- 4.8 Acknowledgments.- References.- 5. Loss of Solderability and Dewetting.- 5.1 Introduction.- 5.2 Characterization of Dewetting.- 5.3 Wetting Stability Diagrams.- 5.4 Dynamics of Wetting Instabilities: Physical Mechanisms.- 5.5 Intermetallic Formation.- 5.6 Conclusions.- 5.7 Acknowledgments.- References.- 6. Oxidation of Solder Coatings.- 6.1 Introduction.- 6.2 Tin-Lead-Copper System Metallurgy.- 6.2.1 Tin-Lead Morphology.- 6.2.2 Intermetallic Underlayer.- 6.3 Role of Oxides in Solderability Loss.- 6.3.1 Wettability and Heat Transfer Effects.- 6.3.2 Copper Substrate Effects.- 6.3.3 Tin and Lead Oxides.- 6.3.4 Relative Effects for Tin-Lead-Copper System.- 6.3.5 Overall Degradation Factors.- 6.4 Tin-Lead Oxidation.- 6.4.1 Thermodynamic Considerations.- 6.4.2 Oxides Formed.- 6.4.3 Oxidation Rate.- 6.4.4 Electrochemical Oxidation.- 6.5 Solderability Assessment Via Oxides.- 6.5.1 Sequential Electrochemical Reduction Analysis.- 6.5.2 Solderability Loss Mechanism.- 6.5.3 Solderability Prediction.- 6.5.4 Solderability Degradation Factors.- 6.5.5 Intermetallic Effects.- 6.6 Accelerated Aging.- 6.6.1 Accelerated Aging Procedures.- 6.6.2 Predictive Capability.- 6.6.3 Oxides Produced by Steam Aging.- 6.7 Future Directions.- References.- 7. Surface and Interface Energy Measurements.- 7.1 Abstract.- 7.2 Introduction.- 7.3 Basic Concepts.- 7.3.1 Definition of the Interface.- 7.3.2 Surface or Interface Energy.- 7.4 Equilibrium Conditions for a Curved Interface.- 7.5 Capillarity Effect in Solids.- 7.5.1 Surface Energy and Surface Stress.- 7.5.2 Anisotropy of Surface Energy.- 7.5.3 Equilibrium Condition at a Triple Point.- 7.6 Experimental Techniques.- 7.6.1 Solid-Vapor Interface Energy.- 7.6.2 Liquid-Vapor Interface Energy.- 7.6.3 Solid-Liquid Interface Energy.- 7.7 Conclusions.- 7.8 Acknowledgments.- References.- 8. Advanced Soldering Processes.- 8.1 Impetus for Change.- 8.1.1 What Would the Ideal Soldering Process Be Like?.- 8.1.2 Possible Enabling Elements of Advanced Soldering Technology.- 8.2 Alternative Approaches to Promote Wetting.- 8.2.1 No-Clean Fluxes.- 8.2.2 Controlled Atmosphere Soldering.- 8.2.3 Laser Ablative Cleaning and Soldering.- 8.2.4 Fluxless Ultrasonic Pretinning.- 8.3 Alternate Heat Sources.- 8.3.1 Laser Heat Sources.- 8.3.2 Focused Microwaves.- 8.4 Solder Bump Technology.- 8.5 Future Directions for Solder Process Technology.- 8.6 Acknowledgments.- References.- 9.0 Reliability-Related Solder Joint Inspection.- 9.1 Abstract.- 9.2 Motivation.- 9.3 Inspection Criteria.- 9.4 Inspection Technologies.- 9.4.1 Visual Systems.- 9.4.2 2-D Inspection Systems.- 9.4.3 3-D Reflectance Systems.- 9.4.4 X-Ray Systems.- 9.4.5 Acoustic Systems.- 9.4.6 Thermal Systems.- 9.5 Mantech/ADSP Solder Joint Inspection Example.- 9.5.1 Mantech/ADSP Visual Inspection Results (Phase 3).- 9.5.2 Mantech/ADSP Automated Inspection Results (Phase 3).- 9.6 Inspection Automation.- 9.7 Advanced Solder Joint Inspection Techniques.- 9.8 Conclusions.- References.- 10. The Properties of Composite Solders.- 10.1 Introduction.- 10.2 Mechanics of Solder Joints.- 10.2.1 Origin of Thermomechanical Fatigue in Solder Joints.- 10.2.2 Origin of Vibration and Shock in Solder Joints.- 10.2.3 Failure Mechanisms in Solder Joints.- 10.3 Alloy Design for Thermomechanical Fatigue Resistance.- 10.3.1 Solder Joints with “Superplastic” Microstructures.- 10.3.2 Alloy Additions to Homogenize the Microstructure.- 10.3.3 Other Solder Alloys.- 10.3.4 Composite Solder Alloys.- 10.4 Methods of Producing Composite Solder Alloys.- 10.4.1 Powder Blending.- 10.4.2 Mechanical Alloying.- 10.4.3 In-Situ Composite Solders by Rapid Solidification.- 10.4.4 Fiber-Reinforced Composites.- 10.5 In-Situ Composite Solders by Rapid Solidification.- 10.5.1 Preparation of Rapidly Solidified In-Situ Composite Solder Powders.- 10.5.2 Microstructures of In-Situ Composite Solders.- 10.6 Properties of Composite Solder Alloys.- 10.6.1 Wetting and Solderability of Composite Solder Alloys.- 10.6.2 Mechanical Properties of In-Situ Composite Solders.- 10.6.3 Mechanical Property Testing.- 10.6.4 Tensile Properties.- 10.6.5 Creep Properties.- 10.6.6 High-Cycle Fatigue Properties (Stress Amplitude Controlled Fatigue).- 10.6.7 Low-Cycle Fatigue Properties (Strain Amplitude Controlled Fatigue).- 10.6.8 Fractography.- 10.6.9 Creep-Fatigue Interactions.- 10.7 Summary.- References.