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Produktbild: Microtransducer CAD

Microtransducer CAD Physical and Computational Aspects

Aus der Reihe Computational Microelectronics

51,99 €

inkl. gesetzl. MwSt., Versandkostenfrei

Beschreibung

Produktdetails

Einband

Taschenbuch

Erscheinungsdatum

03.10.2013

Verlag

Springer Wien

Seitenzahl

427

Maße (L/B/H)

23,5/15,5/2,5 cm

Gewicht

686 g

Auflage

Softcover reprint of the original 1st ed. 1999

Sprache

Englisch

ISBN

978-3-7091-7321-3

Beschreibung

Produktdetails

Einband

Taschenbuch

Erscheinungsdatum

03.10.2013

Verlag

Springer Wien

Seitenzahl

427

Maße (L/B/H)

23,5/15,5/2,5 cm

Gewicht

686 g

Auflage

Softcover reprint of the original 1st ed. 1999

Sprache

Englisch

ISBN

978-3-7091-7321-3

Herstelleradresse

Springer-Verlag KG
Sachsenplatz 4-6
1201 Wien
AT

Email: GPSR Kontakt

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  • Produktbild: Microtransducer CAD
  • 1. Introduction.- 1.1 Modeling and Simulation of Microtransducers.- 1.2 Illustrative Example.- 1.2.1 Thermal Flow Sensor.- 1.2.2 Thermal Sensors and Actuators.- 1.2.3 Goals and Benefits of Modeling and Simulation.- 1.3 Progress in Microtransducer Modeling.- 1.4 References.- 2 Basic Electronic Transport.- 2.1 Poisson’s Equation.- 2.2 Continuity Equations.- 2.3 Carrier Transport in Crystalline Materials and Isothermal Behavior.- 2.3.1 Transport Relations.- 2.3.2 Carrier Concentrations.- 2.3.3 Doping-Induced Band Gap Narrowing.- 2.3.4 Temperature-Dependence of Band Gap Energy.- 2.3.5 Carrier Mobility and Matthiessen’s Rule.- 2.3.6 Generation-Recombination.- 2.4 Electrical Conductivity and Isothermal Behavior in Polycrystalline Materials.- 2.4.1 Doping-Dependence.- 2.4.2 Temperature-Dependence.- 2.5 Electrical Conductivity and Isothermal Behavior in Metals.- 2.6 Boundary and Interface Conditions.- 2.6.1 Ohmic Contacts.- 2.6.2 Schottky Contacts.- 2.6.3 Insulators and Interfaces.- 2.6.4 Outer Boundaries.- 2.7 The External Fields — What Do They Influence?.- 2.8 References.- 3 Radiation Effects on Carrier Transport.- 3.1 Reflection and Transmission of Optical Signals.- 3.1.1 Single- and Multi-Layer Thin Film Systems.- 3.2 Modeling Optical Absorption in Intrinsic Semiconductors.- 3.2.1 Band-to-Band Transitions.- 3.2.2 Absorption Coefficient.- 3.3 Absorption in Heavily-Doped Semiconductors.- 3.3.1 Band-to-Band Absorption Coefficient.- 3.3.2 Free Carrier Absorption Coefficient.- 3.4 Optical Generation Rate and Quantum Efficiency.- 3.5 Low Energy Interactions with Insulators and Metals.- 3.5.1 Refractive Index and Extinction Coefficient.- 3.6 High Energy Interactions and Monte Carlo Simulations.- 3.6.1 Photoelectric Effect, Compton Scattering, and Pair Production.- 3.6.2 Ionization Yield.- 3.6.3 Photon Attenuation Coefficients.- 3.6.4 Monte Carlo Simulations.- 3.7 Model Equations for Radiant Sensor Simulation.- 3.8 Illustrative Simulation Example — Color Sensor.- 3.9 References.- 4 Magnetic Field Effects on Carrier Transport.- 4.1 Galvanomagnetic Transport Equation.- 4.1.1 Galvanomagnetic Effects.- 4.2 Galvanomagnetic Transport Coefficients.- 4.2.1 Magnetic Field Dependence.- 4.2.2 Electric Field Dependence.- 4.3 Equations and Boundary Conditions for Magnetic Sensor Simulation.- 4.3.1 Unipolar Analysis.- 4.3.2 Bipolar Analysis.- 4.4 Illustrative Simulation Example — Micromachined Magnetic Vector Probe.- 4.5 References.- 5 Thermal Non-Uniformity Effects on Carrier Transport.- 5.1 Non-Isothermal Effects.- 5.1.1 The Seebeck, Peltier, and Thomson Effects.- 5.1.2 Wiedemann-Franz Law.- 5.2 Electrothermal Transport Model.- 5.2.1 Governing Equations.- 5.2.2 Boundary Conditions.- 5.3 Electrical and Thermal Transport Coefficients.- 5.3.1 The Seebeck Coefficient in Semiconductors and Metals.- 5.3.2 Thermal Conductivity in Semiconductors, Metals, and Dielectrics.- 5.3.3 Specific Heat in Semiconductors, Metals, and Dielectrics.- 5.4 Electro-Thermo-Magnetic Interactions.- 5.5 Heat Transfer in Thermal Microstructures.- 5.5.1 Governing Equations for Convective Heat Transfer.- 5.5.2 Zero Flow Two-Dimensional Heat Transfer Coefficient.- 5.5.3 Thermal Conductivity of Gases.- 5.5.4 Radiative Heat Transfer.- 5.5.5 Model Simplification for Quasi Three-Dimensional Analysis.- 5.6 Summary of Equations and Computational Procedure.- 5.7 Illustrative Simulation Example — Micro Pirani Gauge.- 5.8 References.- 6 Mechanical Effects on Carrier Transport.- 6.1 Piezoresistive Effect.- 6.1.1 Piezoresistance Coefficients in Monocrystalline Semiconductors.- 6.1.2 Doping- and Temperature-Dependence of Piezoresistance Coefficients.- 6.1.3 Non-Linear Piezoresistance Coefficients.- 6.1.4 Piezoresistance Coefficients in Polycrystalline Semiconductors.- 6.2 Strain and Electron Transport.- 6.2.1 Conduction Band.- 6.2.2 Electron Mobility and Piezoresistance.- 6.3 Strain and Hole Transport.- 6.3.1 Valence Band.- 6.3.2 Hole Mobility and Piezoresistance.- 6.4 Piezojunction Effect.- 6.5 Effects of Stress Gradients.- 6.5.1 Electron Transport.- 6.5.2 Hole Transport.- 6.5.3 Phonon Transport and Heat Flux.- 6.5.4 Thermodynamic Consideration of Electro-Thermo-Mechanical Interactions.- 6.6 Galvano-Piezo-Magnetic Effects.- 6.6.1 Piezo-Hall Coefficients.- 6.7 The Piezo Drift-Diffusion Transport Model.- 6.7.1 Transport Relations.- 6.7.2 Complete System and Summary of Model Equations.- 6.7.3 Discretization Scheme.- 6.7.4 Solution Scheme.- 6.7.5 Evaluation of Terminal Currents.- 6.8 Illustrative Simulation Example — Stress Effects on Hall Sensors.- 6.9 References.- 7 Mechanical and Fluidic Signals.- 7.1 Definitions.- 7.1.1 Transformations.- 7.1.2 Forces.- 7.1.3 Stress.- 7.1.4 Strain and Thermal Expansion.- 7.1.5 Strain-Rate.- 7.2 Model Equations for Mechanical Analysis.- 7.2.1 Governing Equations and Constitutive Relations.- 7.2.2 Simplified Analysis for Single- and Multi-Layer Diaphragms.- 7.2.3 Material Parameters and Extraction.- 7.3 Model Equations for Analysis of Fluid Transport.- 7.3.1 Constitutive Properties.- 7.3.2 Governing Equations.- 7.3.3 Fluidic Damping.- 7.4 Illustrative Simulation Example — Analysis of Flow Channels.- 7.4.1 Model Equations in Vorticity-Stream Function Formulation.- 7.4.2 Rotated Finite Difference Numerical Scheme.- 7.4.3 Computed Flow Profiles.- 7.5 References.- 8 Micro-Actuation.- 8.1 Transduction Principles.- 8.2 State-of-the-Art and Preview.- 8.3 Electrostatic Actuation.- 8.3.1 Electrostatic Analysis.- 8.4 Thermal Actuation.- 8.4.1 Electrothermal Analysis.- 8.4.2 Shape Memory Actuation.- 8.5 Magnetic Actuation.- 8.5.1 Magnetostriction Analysis.- 8.5.2 Electrodynamic Analysis.- 8.5.3 Electromagnetic Drive Analysis.- 8.6 Piezoelectric Actuation.- 8.6.1 Piezoelectric Analysis.- 8.6.2 Electro-Thermo-Mechanical Interactions and Coupling Coefficients.- 8.7 Electroacoustic Transducers.- 8.7.1 Acoustic Wave Propagation in Solids.- 8.7.2 Interactions with Ambient Fluid.- 8.8 Computational Procedure and Coupling.- 8.9 Illustrative Example — CMOS Micromirror.- 8.10 References.- 9 Microsystem Simulation.- 9.1 Electrical Analogues for Mixed-Signals and Historical Developments.- 9.2 Circuit Modeling and Implementation Considerations.- 9.2.1 Multi-Variate Polynomial Dependent Sources.- 9.2.2 Synthesis from Multi-Dimensional Field Equations.- 9.3 Lumped Analysis: Illustrative Example — Electrostatic Micromirror.- 9.3.1 Capacitance and Torque Modeling.- 9.3.2 Verification Using the Panel Method.- 9.3.3 SPICE Simulation.- 9.4 Distributed Analysis: Illustrative Example — Flow Microsensor.- 9.4.1 Model Equations and Circuit Synthesis.- 9.4.2 SPICE Simulation.- 9.5 References.