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Produktbild: Led Packaging for Lighting App

Led Packaging for Lighting App Design, Manufacturing, and Testing

123,99 €

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Beschreibung

Produktdetails

Einband

Gebundene Ausgabe

Erscheinungsdatum

01.08.2011

Verlag

John Wiley & Sons

Seitenzahl

376

Maße (L/B/H)

25,1/17,5/2,7 cm

Gewicht

787 g

Auflage

1. Auflage

Sprache

Englisch

ISBN

978-0-470-82783-3

Beschreibung

Rezension

"The book will be useful as a resource for engineers in LED design or packaging, and as an introduction to the field for advanced students, researchers, lighting designers, and product managers." (Book News, 1 October 2011)

Produktdetails

Einband

Gebundene Ausgabe

Erscheinungsdatum

01.08.2011

Verlag

John Wiley & Sons

Seitenzahl

376

Maße (L/B/H)

25,1/17,5/2,7 cm

Gewicht

787 g

Auflage

1. Auflage

Sprache

Englisch

ISBN

978-0-470-82783-3

Herstelleradresse

Libri GmbH
Europaallee 1
36244 Bad Hersfeld
DE

Email: gpsr@libri.de

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Die Leseprobe wird geladen.
  • Produktbild: Led Packaging for Lighting App
  • Foreword (Magnus George Craford).

    Foreword (C. P. Wong).

    Foreword (B. J. Lee).

    Preface.

    Acknowledgments.

    About the Authors.

    1 Introduction.

    1.1 Historical Evolution of Lighting Technology.

    1.2 Development of LEDs.

    1.3 Basic Physics of LEDs.

    1.3.1 Materials.

    1.3.2 Electrical and Optical Properties.

    1.3.3 Mechanical and Thermal Properties.

    1.4 Industrial Chain of LED.

    1.4.1 LED Upstream Industry.

    1.4.2 LED Midstream Industry.

    1.4.3 LED Downstream Industry.

    1.5 Summary.

    References.

    2 Fundamentals and Development Trends of High Power LED Packaging.

    2.1 Brief Introduction to Electronic Packaging.

    2.1.1 About Electronic Packaging and Its Evolution.

    2.1.2 Wafer Level Packaging, More than Moore, and SiP.

    2.2 LED Chips.

    2.2.1 Current Spreading Efficiency.

    2.2.2 Internal Quantum Efficiency.

    2.2.3 High Light Extraction Efficiency.

    2.3 Types and Functions of LED Packaging.

    2.3.1 Low Power LED Packaging.

    2.3.2 High Power LED Packaging.

    2.4 Key Factors and System Design of High Power LED Packaging.

    2.5 Development Trends and Roadmap.

    2.5.1 Technology Needs.

    2.5.2 Packaging Types.

    2.6 Summary.

    References.

    3 Optical Design of High Power LED Packaging Module.

    3.1 Properties of LED Light.

    3.1.1 Light Frequency and Wavelength.

    3.1.2 Spectral Distribution.

    3.1.3 Flux of Light.

    3.1.4 Lumen Efficiency.

    3.1.5 Luminous Intensity, Illuminance and Luminance.

    3.1.6 Color Temperature, Correlated Color Temperature and Color Rendering Index.

    3.1.7 White Light LED.

    3.2 Key Components and Packaging Processes for Optical Design.

    3.2.1 Chip Types and Bonding Process.

    3.2.2 Phosphor Materials and Phosphor Coating Processes.

    3.2.3 Lens and Molding Process.

    3.3 Light Extraction.

    3.4 Optical Modeling and Simulation.

    3.4.1 Chip Modeling.

    3.4.2 Phosphor Modeling.

    3.5 Phosphor for White LED Packaging.

    3.5.1 Phosphor Location for White LED Packaging.

    3.5.2 Phosphor Thickness and Concentration for White LED Packaging.

    3.5.3 Phosphor for Spatial Color Distribution.

    3.6 Collaborative Design.

    3.6.1 Co-design of Surface Micro-Structures of LED Chips and Packages.

    3.6.2 Application Specific LED Packages.

    3.7 Summary.

    References.

    4 Thermal Management of High Power LED Packaging Module.

    4.1 Basic Concepts of Heat Transfer.

    4.1.1 Conduction Heat Transfer.

    4.1.2 Convection Heat Transfer.

    4.1.3 Thermal Radiation.

    4.1.4 Thermal Resistance.

    4.2 Thermal Resistance Analysis of Typical LED Packaging.

    4.3 Various LED Packages for Decreasing Thermal Resistance.

    4.3.1 Development of LED Packaging.

    4.3.2 Thermal Resistance Decrease for LED Packaging.

    4.3.3 SiP/COB LED Chip Packaging Process.

    4.4 Summary.

    References.

    5 Reliability Engineering of High Power LED Packaging.

    5.1 Concept of Design for Reliability (DfR) and Reliability Engineering.

    5.1.1 Fundamentals of Reliability.

    5.1.2 Life Distribution.

    5.1.3 Accelerated Models.

    5.1.4 Applied Mechanics.

    5.2 High Power LED Packaging Reliability Test.

    5.2.1 Traditional Testing Standards, Methods, and Evaluation.

    5.2.2 Methods for Failure Mechanism Analysis.

    5.2.3 Failure Mechanisms Analysis.

    5.3 Rapid Reliability Evaluation.

    5.3.1 Material Property Database.

    5.3.2 Numerical Modeling and Simulation.

    5.4 Summary.

    References.

    6 Design of LED Packaging Applications.

    6.1 Optical Design.

    6.1.1 Introduction of Light Control.

    6.1.2 Reflectors.